Semiconductor device and method of manufacturing the same

ABSTRACT

Disclosed is a semiconductor device having a substrate including first and second regions. First interlayer insulation layers and conductive patterns alternately are stacked on a first region of the substrate. A second interlayer insulation layer covers the first interlayer insulation layers and the conductive patterns. A resistor is formed in the second interlayer insulation layer in the second region of the substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a division of U.S. patent application Ser. No.13/830,727 filed on Mar. 14, 2013, which is based on and claims priorityfrom Korean Patent Application No. 10-2012-0145241, filed on Dec. 13,2012, with the Korean Intellectual Property Office. The disclosure ofeach of the foregoing application is incorporated herein in its entiretyby reference.

BACKGROUND

1. Field

The present invention relates to a semiconductor device and a method ofmanufacturing the same, and more particularly, to a semiconductor deviceincluding resistors and a method of manufacturing the same.

2. Discussion of Related Art

A semiconductor device uses a resistor in a circuit for applying orcontrolling an operation voltage of the semiconductor device in order togenerate a desired level of bias. The resistor is representatively usedin a pump regulator circuit for distributing a voltage. Since theresistor is formed in a single layer having a specific size, severalresistors needs to be coupled by using contact plugs and metal wiringsin order to implement a necessary resistance value.

In the meantime, in order to improve integration of the semiconductordevice, a 3D semiconductor device in which memory cells arethree-dimensionally arranged has been suggested. The 3D semiconductordevice includes a cell array region, a contact region, a peripheralregion, and a resistance element region. The cell array region is aregion in which memory cells for storing data, and word lines and bitlines coupled to the memory cells are formed. The contact region is aregion in which the word lines extended from the cell array region arearranged. The peripheral circuit region is a region in which drivingtransistors configuring a circuit for driving the memory cells arearranged. The resistance element region is a region in which theresistors are formed.

The word lines arranged in the contact region and the drivingtransistors of the peripheral circuit region may be electrically coupledthrough contact plugs and metal wirings. The resistors in the resistanceelement region and the driving transistors in the peripheral circuitregion are simultaneously formed, so that the driving transistors andthe resistors need to be arranged in different regions of a substrate.Further, since a plurality of resistors is formed in the resistanceelement region, an area of the resistance element region occupied in anentire area of the semiconductor device is large. Accordingly, there isa limit to improve integration of the semiconductor device due to theresistance element region.

SUMMARY

The present invention has been made in an effort to provide asemiconductor device capable of improving integration and a method ofmanufacturing the same.

An exemplary semiconductor device includes a substrate including firstand second regions; first interlayer insulation layers and conductivepatterns alternately stacked on a first region of the substrate; asecond interlayer insulation layer covering the first interlayerinsulation layers and the conductive patterns; and a resistor formed inthe second interlayer insulation layer in the second region of thesubstrate.

An exemplary method of manufacturing a semiconductor device includesalternately stacking first material layers and second material layers ona substrate including a first region and a second region; etching thefirst material layers and the second material layers formed on thesecond region; forming an interlayer insulation layer in the secondregion in which the first material layers and the second material layersare etched; forming a first recess region by etching the interlayerinsulation layer on the second region of the substrate; and forming aresistor inside the first recess region.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent to those of ordinary skill in the art bydescribing in detail embodiments thereof with reference to the attacheddrawings in which:

FIG. 1 is a view for describing a semiconductor device according to anexemplary embodiment of the present invention.

FIGS. 2A to 2I are views for describing a semiconductor device accordingto an exemplary embodiment of the present invention, and a method ofmanufacturing the same.

FIG. 3 is a view for describing a semiconductor device according to anexemplary embodiment of the present invention, and a method ofmanufacturing the same.

FIG. 4 is a configuration diagram illustrating an exemplary memorysystem.

FIG. 5 is a configuration diagram illustrating an exemplary computingsystem.

DETAILED DESCRIPTION

Hereinafter, an embodiment of the present invention will be describedwith reference to the accompanying drawings in detail. However, thepresent invention is not limited to an embodiment disclosed below andmay be implemented in various forms and the scope of the presentinvention is not limited to the following embodiments. Rather, theembodiment is provided to more sincerely and fully disclose the presentinvention and to completely transfer the spirit of the present inventionto those skilled in the art to which the present invention pertains, andthe scope of the present invention should be understood by the claims ofthe present invention.

FIG. 1 is a view for describing a semiconductor device according to anexemplary embodiment of the present invention.

Referring to FIG. 1, the semiconductor device according to an exemplaryembodiment of the present invention includes a cell array region CAR,one or more contact regions CTR, one or more peripheral circuit regionsPAR, and one or more resistance element regions RAR1 and RAR2. The cellarray region CAR is a region in which cell strings, word lines, firstand second select lines, and bit lines are formed. Each of the cellstrings includes first and second select transistors, and the memorycells coupled between the first and second select transistors. The bitlines are conductive patterns coupled to the cell strings. The wordlines are conductive patterns coupled to gates of the memory cells. Thefirst and second select lines are conductive patterns coupled to gatesof the first and second select transistors, respectively.

The contact regions CTR are regions in which edges of the word lines,extended from the cell array region CAR, and edges of the first andsecond select lines, extended from the cell array region CAR, arearranged. The contact regions CTR may be disposed at both sides of thecell array region CAR.

The peripheral circuit regions PAR are regions in which drivingtransistors configuring a circuit for driving the memory cells arearranged. The peripheral circuit regions PAR may be adjacently disposedto the contact regions CTR. Although it is not illustrated in thedrawing, the peripheral circuit regions PAR may be adjacently disposedto the cell array region CAR. The driving transistors may be coupled tothe word lines, the first select line, or the second select line of thecontact region CTR through contact plugs and metal wirings.

The resistance element regions RAR1 and RAR2 are regions in whichresistors that distribute a voltage are arranged. The resistance elementregions RAR1 and RAR2 may overlap at least one of the peripheral circuitregions PAR and the contact regions CTR. For example, the resistanceelement regions RAR1 and RAR2 may include first resistance elementregions RAR1 that overlap the peripheral circuit regions PAR, and secondresistance element regions RAR2 that overlap the contact regions CTR.

As described above, the exemplary semiconductor device includes theresistance element regions RAR1 and RAR2 that overlap at least one ofthe peripheral circuit regions PAR and the contact regions CTR.Accordingly, it is not necessary to prepare a separate space in asubstrate for disposing the resistance element regions RAR1 and RAR2,thereby achieving high integration of the semiconductor device.

An exemplary resistor will be described in more detail with reference tothe drawings below. For the convenience of description, the cell arrayregion and the peripheral circuit region are illustrated based on onecell string and one driving transistor below, but a plurality of cellstrings may be formed in the cell array region and a plurality ofdriving transistors may be formed in the peripheral circuit region.

FIGS. 2A to 2I are views for describing an exemplary semiconductordevice and a method of manufacturing the same.

Referring to FIG. 2A, an isolating layer 103 is formed in a substrate101 including a cell array region CAR, a contact region CTR, and aperipheral circuit region PAR. An impurity for forming a well structureand an impurity for adjusting a threshold voltage may be injected intothe substrate 101.

Next, a gate insulation layer 105 and a first conductive layer 109 aresequentially formed on the substrate 101. The gate insulation layer 105may have the same thickness in the cell array region CAR and theperipheral circuit region PAR. The gate insulation layer 105 may bethicker in the peripheral circuit region PAR, as compared to the cellarray region CAR. The gate insulation layer 105 may have may be thinnerin the peripheral circuit region PAR, as compared to the cell arrayregion CAR. The first conductive layer 109 may be used as a pipe gate ofa pipe transistor and a driving gate of a driving transistor.

Then, a trench 111 is formed by etching the first conductive layer 109of the cell array region CAR. Next, the trench 111 is filled with asacrificial layer 113.

Referring to FIG. 2B, a second conductive layer 115 may be furtherformed on the first conductive layer 109, including the trench 111filled with the sacrificial layer 113. Next, a pipe gate PG and adriving gate DG are formed by etching the first conductive layer 109 andthe second conductive layer 115. In this case, the gate insulation layer105 may be further etched so that a first gate insulation pattern 105Amay be formed under the pipe gate PG, and a second gate insulationpattern 105B may be formed under the driving gate DG.

The pipe gate PG may be formed of a structure in which a firstconductive pattern 109A and a second conductive pattern 115A arestacked. The pipe gate PG is extended toward the contact region CTR fromthe cell array region CAR.

The driving gate DG may be formed simultaneously with the pipe gate PG,and may be formed in the structure in which a first conductive pattern109B and a second conductive pattern 115B are stacked.

Subsequently, an impurity for forming a source region S and a drainregion D may be injected into the substrate 101 at both sides of thedriving gate DG by using a mask (not shown) as an impurity injectionbarrier. Then, the mask used as the impurity injection barrier may beremoved. Accordingly, the driving transistor DTR is formed in theperipheral circuit region PAR.

Referring to FIG. 2C, a first interlayer insulation layer 121, filling aspace between the pipe gate PG and the driving gate DG, is formed. Next,first material layers 131 and second material layers 133 are alternatelystacked on an entire structure, including the first interlayerinsulation layer 121, the first conductive pattern 109B, and the secondconductive pattern 115B.

The first material layers 131 may be formed where second interlayerinsulation layers are formed. The second material layers 133 may beformed where word lines or select lines are formed. The select line maybe formed on one or more layers. A layer where a select line is formedand a layer where a word line is formed may have the same or differentthicknesses.

The first material layers 131 and the second material layers 133 may beformed with material layers having a large difference etchingselectivities. For example, the first material layers 131 may be oxidelayers that may serve as second interlayer insulation layers, and thesecond material layers 133 may be conductive layers, such as polysiliconlayers, metal layers, or metal silicide layers. Alternatively, the firstmaterial layers 131 may be oxide layers that may serve as the secondinterlayer insulation layers, and the second material layers 133 may benitride layers that may serve as the sacrificial layers. Alternatively,the first material layers 131 may be undoped polysilicon layers that mayserve as sacrificial layers, and the second material layers 133 may bedoped polysilicon layers that may serve as the word lines or the selectlines.

Next, first and second through holes 141A and 141B are formed by etchingthe first material layers 131 and the second material layers 133 of thecell array region CAR. The first and second through holes 141A and 141Bare connected to the trench 111. IF the second conductive layer isformed, the first and second through holes 141A and 141B may be formedby further etching the second conductive pattern 115A of the pipe gatePG. Accordingly, the sacrificial layer 113 inside the trench 111 isexposed.

Referring to FIG. 2D, the trench 111 is opened by removing thesacrificial layer 113. As a result, a U-shaped channel hole includingthe first through hole 141A, the trench 111 connected to the firstthrough hole 141A, and the second through hole 141B connected to thetrench 111 is formed.

Next, at least one layer of a third material layer 151 is formed alongsurfaces defining the first and second through holes 141A and 141B andthe trench 111. The third material layer 151 may include at least one ofa charge blocking layer, a memory layer, and a tunnel insulation layer.The charge blocking layer may prevent the charges from moving toward theword lines of the memory cell, and may be an oxide layer or a highdielectric layer having a dielectric constant larger than that of thesilicon oxide layer. The memory layer serves as a data storing layer ofthe memory cell, and may be a nitride layer in which a charge may betrapped. The tunnel insulation layer may be formed of an oxide.

Next, a channel structure CH is formed along surfaces defining the firstand second through holes 141A and 141B and the trench 111 in which thethird material layer 151 is formed. The channel structure CH may beformed in a tubular shape having an open central portion. The channelstructure CH includes a first channel layer 153A formed inside the firstthrough hole 141A, a second channel layer 153B formed inside the secondthrough hole 141B, and a pipe channel layer 153C formed inside thetrench 111 to couple the first and second channel layers 153A and 153B.The channel structure CH may be formed of a semiconductor material, suchas a polysilicon layer.

Next, the central portion of the channel structure CH is filled with afirst insulation layer 155.

Sidewalls and a bottom surface of the pipe channel layer 153C aresurrounded by the first conductive pattern 109A of the pipe gate PG.Further, a top surface of the pipe channel layer 153C may be covered bythe second conductive pattern 115A of the pipe gate PG. The secondconductive pattern 115A may serve to increase an electric field appliedto the pipe channel layer 153C.

Referring to FIG. 2E, the first material layers 131 and the secondmaterial layers 133 are etched, so that edges of the first materiallayers 131 and edges of the second material layers 133 have a stepwisestructure in the contact region CTR. In this case, the first materiallayers 131 and the second material layers 133 may be removed in theperipheral circuit region PAR. In order to pattern the first materiallayers 131 and the second material layers 133 in the stepwise structure,a photoresist pattern (not shown) is formed on the first material layers131 and the second material layers 133, and then the first materiallayers 131 and the second material layers 133 are repeatedly etchedusing the photoresist pattern as an etching barrier. A size of thephotoresist pattern is reduced whenever the etching process of the firstmaterial layers 131 and the second material layers 133. After thestepwise structure is formed, the residual photoresist pattern isremoved.

Then, a third interlayer insulation layer 161 is formed on an entirestructure in which the stepwise structure is formed. The thirdinterlayer insulation layer 161 fills a region in which the firstmaterial layers 131 and the second material layers 133 are etched. Thethird interlayer insulation layer 161 covers the stepwise structure ofthe contact region CTR and the driving transistor DTR of the peripheralcircuit region PAR. A surface of the third interlayer insulation layermay be flat. In order to planarize the surface of the third interlayerinsulation layer 161, a chemical mechanical polishing (CMP) process maybe performed.

Referring to FIG. 2F, a slit 171 is formed by etching the first materiallayers 131 and the second material layers 133 of the cell array regionCAR. The first material layers 131 and the second material layers 133may be isolated for each memory block or be isolated for each linethrough the slit 171. Further, the side surfaces of the first materiallayers 131 and the second material layers 133 are exposed through theslit 171. The slit 171 may be formed between the first and secondchannel layers 153A and 153B, in order to divide the first materiallayers 131 and the second material layers 133 into a part surroundingthe first channel layer 153A and a part surrounding the second channellayer 153B.

A subsequent process may be varied according to a composition of thefirst material layers 131 and the second material layers 133.

For example, if the first material layers 131 are formed of oxide layersthat may serve as second interlayer insulation layers, and the secondmaterial layers 133 are nitride layers that may serve as the sacrificiallayers, then the second material layers 133 exposed through the slit 171may be removed by a selective etching process. Accordingly, a firstrecess region 173 is formed in a region in which the second materiallayers 133 are removed. Further, second interlayer insulation patternsILD are formed from the first material layers 131.

Referring to FIG. 2G, conductive patterns 181A to 181E, which serve asthe word lines and the select lines, are formed by filling the firstrecess region 173 with a conductive material. At least one layer ofuppermost conductive patterns, among the conductive patterns 181A to181E, may be used as select lines. Lower conductive patterns may be usedas the word lines. The select line that surrounds the first channellayer 153A may be a first select line, and a select line surrounding thesecond channel layer 153B may be a second select line. One of the firstselect line or the second select lines is a source select line, and theremaining one of the first select line or the second select lines is adrain select line. Before the first recess region 173 is filled with theconductive material, at least one of the charge blocking layer, thememory layer, or the tunnel insulation layer may be formed in an innersurface of the first recess region 173. For example, a layer, among thecharge blocking layer, the memory layer, and the tunnel insulationlayer, which is not formed along the inner surface defining the firstand second through holes 141A and 141B, may be formed along an innersurface defining the first recess region 173.

Although it is not illustrated in the drawing, if the first materiallayers 131 are oxide layers that may serve as the second interlayerinsulation layers, and the second material layers 133 are conductivelayers, then the conductive patterns 181A to 181E and the secondinterlayer insulation patterns ILD may be defined by the slit 171.

Alternatively, if the first material layers 131 are undoped polysiliconlayers that may serve as the sacrificial layers, and the second materiallayers 133 are doped polysilicon layers, then the conductive patterns181A to 181E may be defined by the slit 171. In this example, only thefirst material layers 131 exposed through the sift 171 are removed bythe selective etching process. Accordingly, the first recess regions areformed in the regions in which the first material layers 131 areremoved. Next, the second interlayer insulation patterns ILD are formedby filling the first recess regions with an insulation material for thesecond interlayer insulation layer.

As described above, after the conductive patterns 181A to 181E and thesecond interlayer insulation patterns ILD are formed by variousprocesses, and a second insulation layer 183 is formed in the slit 171.

Referring to FIG. 2H, second to fifth recess regions 191A to 191D areformed by etching the first insulation layer 155 of the cell arrayregion CAR and the third interlayer insulation layer 161 of the contactregion CTR and the peripheral circuit region PAR by a partial thicknessusing an etching process using a mask (not shown) as an etching barrier.Accordingly, a height of the first insulation layer 155 is less than aheight of the first and second channel layers 153A and 153B. Here, themask may be formed as a pattern for defining the second to fifth recessregion 191A to 191D, and may be removed after the forming of the secondto fifth recess regions 191A to 191D.

The second to fifth recess regions 191A to 191D may be formed to havethe same depth or different depths. For example, if the first insulationlayer 155 and the third interlayer insulation layer 161 are formed ofthe same material, then the second to fifth recess regions 191A to 191Dmay be formed to have the same depth. Alternatively, if the firstinsulation layer 155 and the third interlayer insulation layer 161 areformed of different materials, then the second to fifth recess regions191A to 191D may have different depths.

The second recess region 191A is disposed in the peripheral circuitregion PAR, the third recess region 191B is disposed in the contactregion CTR, the fourth recess region 191C is disposed inside the firstthrough hole 141A, and the fifth recess region 191D is disposed insidethe second through hole 141B.

A plurality of second and third recess regions 191A and 191B may beformed. The shapes and sizes of the plurality of second and third recessregions 191A and 191B may be based on a size of a resistor to be formed,Further, the second recess region 191A may be spaced apart from thedriving transistor DTR or overlapped with the driving transistor DTR.

Referring to FIG. 2I, the second to fifth recess regions 191A to 191Dare filled with a conductive material, Accordingly, a first resistor195A is formed inside the second recess region 191A, and a secondresistor 195B is formed inside the third recess region 191B.Accordingly, a first resistance element region RAR1 that overlaps theperipheral circuit region PAR is defined and a second resistance elementregion RAR2 that overlaps the contact region CTR is defined.

Shapes or sizes of the first resistor 195A or the second resistor 195Bmay be varied based on a desired size or shape of resistor.

Further, a first conductive plug 195C is formed inside the fourth recessregion 191C, and a second conductive plug 195D is formed inside thefifth recess region 191D. The first and second conductive plugs 195C and195D are coupled to the contact plugs to be formed on the channelstructure CH in a subsequent process to serve to improve contactresistance for the contact plug. Further, the first and secondconductive plugs 195C and 195D and the first and second resistors 195Aand 195B may be formed of a doped polysilicon layer. In this case, thefirst and second conductive plugs 195C and 195D may overlap theconductive patterns (for example, the conductive patterns 181E) for theselect line to be used as the source region and the drain region.

When the second to fifth recess regions 191A to 191D are filled with theconductive material, the planarization process may be performed so thatthe conductive material is remains only inside the second to fifthrecess regions 191A to 191D. In this case, the mask for defining thesecond to fifth recess regions 191A to 191D may be used as aplanarization stopping layer. In this case, the mask for defining thesecond to fifth recess regions 191A to 191D may be removed after thefirst and second resistors 195A and 195B and the first and secondconductive plugs 195C and 195D are formed.

As described above, the first and second conductive plugs 195C and 195Dof the cell array region CAR and the first and second resistors 195A and195B may be simultaneously formed, so that a process of manufacturingthe semiconductor device including the resistor may be simplified. Thefirst and second resistors 195A and 195B and the first and secondconductive plugs 195C and 195D may be simultaneously formed, so that thefirst and second resistors 195A and 195B may have the same heights asthe first and second conductive plugs 195C and 195D. The first andsecond resistors 195A and 195B may be separated from the drivingtransistor DTR and the conductive patterns 181A to 181E through thethird interlayer insulation layer 161. Accordingly, the first and secondresistance element regions RAR1 and RAR2 in which the first and secondresistors 195A and 195B may overlap the peripheral circuit region PARand the contact region CTR, respectively, thereby improving integrationof the semiconductor device.

In an exemplary embodiment, the cell string is formed in an U shapealong the channel structure CH, including the first and second channellayers 153A and 153B, and extends higher than the substrate 101 in thecell array region CAR, and higher than the pipe channel layer 153Ccoupling the first and second channel layers 153A and 153B. The firstand second channel layers 153A and 153B are formed inside the first andsecond through holes 141A and 141B and pass through the secondinterlayer insulation patterns ILD and the conductive patterns 181A to181E, which are alternately stacked on the substrate 101. Accordingly,the first and second channel layers 153A and 153B are surrounded by thesecond interlayer insulation patterns ILD and the conductive patterns181A to 181E. The pipe channel layer 153C is disposed inside the trench111 of the pipe gate PG, which is formed under the first and secondchannel layers 153A and 153B and stacked on the substrate 101.Accordingly, the pipe channel layer 153C is surrounded by the pipe gatePG. A pipe transistor is defined in a crossing portion of the pipechannel layer 153C and the pipe gate PG. The memory cells are defined incrossing portions of the first and second channel layers 153A and 153Band the conductive patterns for the word lines (for example, theconductive patterns 181A to 181D), and the select transistors aredefined in crossing portions of the first and second channel layers 153Aand 153B and the conductive patterns for the select line (for example,the conductive pattern 181E).

Although it is not illustrated in the drawing, after the first andsecond conductive plugs 195C and 195D and the first and second resistors195A and 195B are formed, the common source line, the bit lines, thecontact plugs, and the metal wirings are formed. Here, at least one (forexample, a first contact plug) of the contact plugs is coupled to one ofthe conductive patterns 181A to 181E, at least one (for example, asecond contact plug) among the contact plugs is coupled to the drivingtransistor DTR, and at least one of the metal wirings is coupled to thefirst and second contact plugs, so that the driving transistor DTR maybe coupled with the conductive patterns 181A to 181E. In this case, thefirst contact plug, which passes through the third interlayer insulationlayer 161, is disposed so as not to be coupled to the second resistor195B, and the second contact plug, which passes through the thirdinterlayer insulation layer 161, is disposed so as not to be coupled tothe first resistor 195A. Further, although it is not illustrated in thedrawing, third contact plugs are formed on the first resistor 195A andthe second resistor 195B, and a metal wiring coupling a part among thethird contact plugs may be formed. Accordingly, the resistors havingvarious values may be implemented by coupling the first resistor 195Aand the second resistor 195B.

FIG. 3 is a view for describing an exemplary semiconductor device, and amethod of manufacturing the same.

The exemplary semiconductor device includes a substrate 201 including acell array region CAR, the contact region CTR, and the peripheralcircuit region PAR, and resistance element regions RAR1 and RAR2overlapping at least one of the contact region CTR and the peripheralcircuit region PAR on the substrate 201. The first resistance elementregion RAR1 may overlap the peripheral circuit region PAR and the secondresistance element region RAR2 may overlap the contact region CTR. Anisolation layer 203 for isolating elements may be formed inside thesubstrate 201.

A source region S1 of the cell string may be formed inside the substrate201 in the cell array region CAR, and a plurality of cell stringscoupled to the source region S1 is formed on the substrate 201 in thecell array region CAR. Each of the cell strings is formed along achannel structure CH including a channel layer 253 extending higher thanan upper portion of the substrate 201.

The channel layer 253 is formed along side walls defining the throughhole 241, which passes through first interlayer insulation patterns ILDand the conductive patterns 281A to 281F, which are alternately stackedon the substrate 201. Accordingly, the channel layer 253 is coupled tothe source region S1, and is surrounded with the first interlayerinsulation patterns ILD and the conductive patterns 281A to 281F. Thechannel layer 253 may be formed in a tubular shape manner having an opencentral portion, and the central portion of the tubular shape is filledwith a first insulation layer 255. The first insulation layer 255 mayhave a height that is lower than a height of the channel layer 253.

A material layer 251 including a charge stopping layer, a memory layer,or a tunnel insulation layer may be formed between the channel layer 253and the conductive patterns 281A to 281F. The material layer 251 may beextended to a space between the channel layer 253 and the firstinterlayer insulation patterns ILD.

The conductive patterns 281A to 281F and the first interlayer insulationpatterns ILD are extended from the cell array region CAR to the contactregion CTR. Edges of the conductive patterns 281A to 281F and the firstinterlayer insulation patterns ILD are formed in the contact region CTRin a stepwise structure.

At least one layer of lowermost conductive pattern, among the conductivepatterns 281A to 281F, may be used as a first select line. At least onelayer of uppermost conductive pattern, among the conductive patterns281A to 281F, may be used as a second select line. Conductive patternsbetween the first select line and the second line may be used as theword lines. Memory cells are defined in crossing portions of the channellayer 253 and the conductive patterns for the word lines (for example,conductive patterns 281B to 281E). A first select transistor is definedin a crossing portion of the channel layer 253 and the conductivepattern for the first select line (for example, the conductive pattern281A). A second select transistor is defined in a crossing portion ofthe channel layer 253 and the conductive pattern for the second selectline (for example, the conductive pattern 281F).

The conductive patterns 281A to 281F and the first interlayer insulationpatterns ILD may be isolated for each memory block or for each line by aslit 271 passing through the conductive patterns 281A to 281F and thefirst interlayer insulation patterns ILD. The slit 271 may be formedbetween the channel layers 253. The slit 271 is filled with a secondinsulation layer 283.

A driving transistor DTR is formed in the peripheral circuit region PAR.The driving transistor DTR includes a gate insulation layer 205 formedon the substrate 201, a driving gate DG formed on the gate insulationlayer 205, and a source region S2 and a drain region D2 formed insidethe substrate 201 at both sides of the driving gate DG.

The driving transistor DTR, the conductive patterns 281A to 281F, andthe first interlayer insulation patterns ILD of the contact region CTR,which have the stepwise structure, are covered by a second interlayerinsulation layer 261. The second interlayer insulation layer 261 may beformed to have a flat surface.

At least one first recess region 291A is formed in the second interlayerinsulation layer 261 of the peripheral circuit region PAR, and at leastone second recess region 291B is formed in the second interlayerinsulation layer 261 of the contact region CTR. A third recess region291C is defined by the first insulation layer 255, which is lower thanthe channel layer 253, in the through hole 241. The first to thirdrecess regions 291A, 291B, and 291C may be formed to have the same depthor different depths. A first resistor 295A is formed in the first recessregion 291A, a second resistor 295B is formed in the second recessregion 291B, and a conductive plug 295C is formed in the third recessregion 291C. The first resistors 295A may be overlap the drivingtransistor DTR.

The first conductive plug 295C of the cell array region CAR and thefirst and second resistors 295A and 295B may be simultaneously formed,so that a process of manufacturing the semiconductor device includingthe resistor may be simplified. The first and second resistors 295A and295B and the conductive plug 295C may be simultaneously formed, so thatthe first and second resistors 295A and 295B may a same height as aheight of the conductive plug 295C. The first and second resistors 295Aand 295B may be separated from the driving transistor DTR and theconductive patterns 281A to 281F by the second interlayer insulationlayer 261. The first resistance element region RAR1 may overlap theperipheral circuit region PAR and second the resistance element regionRAR2 in may overlap the contact region CTR, thereby improvingintegration of the semiconductor device.

An exemplary method of manufacturing the semiconductor device will bedescribed in more detail below.

The isolation layer 203 is formed on the substrate 201 including thecell array region CAR, the contact region CTR, and the peripheralcircuit region PAR. An impurity for forming a well structure and animpurity for adjusting a threshold voltage may be injected into thesubstrate 201. Further, an impurity for forming the source region S1 ofthe cell string may be injected into the substrate 201.

Next, the gate insulation layer 205 and the driving gate DG are formedon the substrate 201 in the peripheral circuit region PAR, and then thesource region S2 and the drain region D2 may be formed by injecting theimpurity into the substrate 201 at both sides of the driving gate DG. Asa result, the driving transistor DTR is formed.

Next, the first material layers 131 and the second material layers 133are alternately stacked as illustrated in FIG. 2C A through hole 241 isformed by etching the first material layers 131 and the second materiallayers 133. Subsequently, the material layer 251, which includes atleast one of the charge blocking layer, the memory layer, or the tunnelinsulation layer, is formed along the surface of the through hole 241,and the channel layer 253 and the first insulation layer 255 are formedas illustrated in FIG. 2D.

Subsequent processes are similar to those described above, withreference to FIGS. 2E to 2I.

FIG. 4 is a configuration diagram illustrating an exemplary memorysystem.

Referring to FIG. 4, an exemplary memory system 1100 may include anon-volatile memory device 1120 and a memory controller 1110.

The non-volatile memory device 1120 may include the semiconductor memorydevices described with reference to FIGS. 1 to 3. The non-volatilememory device 1120 may be provided as a multi-chip package including aplurality of flash memory chips.

The memory controller 1110 is configured to control the non-volatilememory device 1120, and may include an SRAM 1111, a CPU 1112, a hostinterface 1113, an ECC 1114, and a memory interface 1115. The SRAM 1111is used as an operation memory of the CPU 1112, the CPU 1112 performs ageneral control operation for data exchange of the memory controller1110, and the host interface 1113 includes a data exchange protocol of ahost coupled with the memory system 1100. Further, the ECC 1114 detectsand corrects an error included in data read from the non-volatile memorydevice 1120, and the memory interface 1115 performs interfacing with thenon-volatile memory device 1120. In addition, the memory controller 1110may further include a ROM, or the like, for storing code data forinterfacing with a host.

The memory system 1100 including the aforementioned configuration may bea memory card or a Solid State Disk (SSD) in which the non-volatilememory device 1120 is combined with the memory controller 1110. Forexample, when the memory system 1100 is the SSD, the memory controller110 may communicate with an external device (for example, a host)through one among various interface protocols, such as USB, MMC, PCI-E,SATA, PATA, SCSI, ESDI, or IDE.

FIG. 5 is a configuration diagram illustrating an exemplary computingsystem according.

Referring to FIG. 5, the exemplary computing system 1200 may include aCPU 1220 electrically connected to a system bus 1260, a RAM 1230, a userinterface 1240, a modem 1250, and a memory system 1210. Further, whenthe computing system 1200 is a mobile device, the computing system 1200may further include a battery for supplying an operating voltage to thecomputing system 1200, and may further include an application chip-set,a Camera Image Processor (CIS), or a mobile DRAM.

The memory system 1210 may include a non-volatile memory 1212 and amemory controller 1211 as described with reference to FIG. 4.

As described above, the embodiment has been disclosed in the drawingsand the specification. The specific terms used herein are for purposesof illustration, and do not limit the scope of the present inventiondefined in the claims. Accordingly, those skilled in the art willappreciate that various modifications and another equivalent example maybe made without departing from the scope and spirit of the presentdisclosure. Therefore, the sole technical protection scope of thepresent invention will be defined by the technical spirit of theaccompanying claims.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: alternately stacking first material layers andsecond material layers on a substrate including a first region and asecond region; etching the first material layers and the second materiallayers formed on the second region; forming an interlayer insulationlayer in the second region in which the first material layers and thesecond material layers are etched; forming a first recess region byetching the interlayer insulation layer on the second region of thesubstrate; and forming a resistor inside the first recess region.
 2. Themethod of claim 1, further comprising: forming a through hole passingthrough the first material layers and the second material layers formedon the first region of the substrate; forming a tubular-shaped channellayer along a surface defining the through hole, so that the channellayer has an open central portion; forming an insulation layer in thecentral portion of the tubular-shaped channel layer; forming a secondrecess region in the through hole by etching the insulation layer; andforming a conductive plug in the second recess region.
 3. The method ofclaim 2, wherein the forming the second recess region and the formingthe first recess region are simultaneously performed.
 4. The method ofclaim 2, wherein the forming a conductive plug and the forming aresistor are simultaneously performed.
 5. The method of claim 1, furthercomprising: forming a driving gate in the second region before theforming of the first material layers and the second material layers. 6.The method of claim 5, wherein the forming a resistor further comprises:forming a first resistor to overlap the driving gate.
 7. The method ofclaim 1, wherein the etching the first material layers and the secondmaterial layers further comprises: etching edges of the first materiallayers and edges of the second material layers in the second region tohave a stepwise structure.
 8. The method of claim 7, wherein theinterlayer insulation layer covers the stepwise structure, and theresistor includes a second resistor disposed in the interlayerinsulation layer.
 9. The method of claim 1, wherein the resistor isformed of a doped polysilicon layer.